Re: [情報] 記憶體顆粒的不同(轉載)
看板PC_Shopping (個人電腦購買)作者wolflsi (港都狼仔)時間16年前 (2009/03/24 00:12)推噓21(21推 0噓 30→)留言51則, 22人參與討論串1/2 (看更多)
※ 引述《mingmingki (ming)》之銘言:
: 關於記憶體顆粒的不同
: 有人提出下列看法,還蠻有道理的
: http://www.mobile01.com/topicdetail.php?f=159&t=425730&p=5 (轉載如下)
: 我聽到的解釋是這樣 :
: 一般來說,記憶體顆粒是晶圓所製造.正中央的部份,就是世面上美光,三星,海力士等公司
: 買去,封裝成記憶體顆粒.
: 而邊邊角角顆粒的晶圓部份,就會被威鋼,創見買下,並封裝為自有品牌的顆粒,再來製作成
: 記憶體來行銷.
: 中間的記憶體100%可通過最嚴刻的測試.(當然,創見正廠顆粒就屬這一類)
: 至於邊邊角角的,能通過簡單的測試;但較高層次的測試就無法通過(JET-RAM就屬這一類).
: 所以一般原廠(EX : 華碩,宏碁,富士通,HP等)會去選擇中間部份的晶圓所製成的記憶體顆
: 粒,避免對自己品牌的聲譽造成損害.
: 參考看看唄.
就在下的淺淺知識,通常客戶把Wafer送到封測廠封裝時,會先進行電測,對上面的Die
進行相關電氣性能測試(可能客戶自己做,也可能交給測試廠,看產品機密性及重要性)
依照測試出的結果,會把die分成不同的bin,把NG品歸類為差品或點上INK,封裝進行時,
若要求分BIN作業,黏晶作業時就會把不同的BIN分批出來,這樣就算完成分類的程序。
當然也有不要求的,只分GOOD與NG兩種DIE,這時出來的產品體質可能就有彼此差異。
因為記憶體模組是由8~16個顆粒(以Non-ECC為例)組成,各顆粒間若有體質的差異,同樣
會影響到整條模組,所以許多超頻記憶體廠商會強調所謂的顆粒配對,針對單顆去測試,
將體質相近的組成模組,這樣較能確保超頻幅度及穩定性,不過相對費工費時,所以一般
的記憶體模組就不會這樣搞囉,只要把顆粒裝上去,整條在固定參數下測試OK就出廠了~
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